SEOUL/SINGAPORE – Samsung Electronics’ latest high bandwidth memory (HBM) chips have yet to pass Nvidia’s tests for use in the U.S. firm’s AI processors due to heat and power consumption issues, according to three individuals briefed on the matter. This delay in meeting Nvidia’s standards affects both Samsung’s HBM3 chips, which are widely used in … Continue reading Samsung’s HBM chips fail Nvidia tests due to heat and power issues, sources say